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Q20UDHCPU Mitsubishi MELSEC-Q Series Programmable controller CPU

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12-month warranty (new) · 3-month (used/refurbished)
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Quick facts

AvailabilityConfirmed on request
CategoryMitsubishi MELSEC-Q Series – CPU
LifecycleActive mature
Warranty12-month (new) · 3-month (used/refurbished)

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When can Q20UDHCPU be shipped?

Q20UDHCPU is sourced on request — request a quote and we'll confirm the exact availability and shipping timeline for this specific unit.

Can I pick up Q20UDHCPU in person?

Local pickup from our Groningen, Netherlands warehouse may be possible — contact us before ordering to check availability and arrange a collection time.

Is express delivery available?

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For a critical breakdown, contact us directly at +31 (0)50-7110348 or sales@partnerplc.com — we can look into same-day courier or dedicated taxi/hotshot delivery for Q20UDHCPU, subject to availability and destination.

The Mitsubishi Electric Q20UDHCPU is a programmable controller CPU in the MELSEC-Q Series. Number of I/O points: 4096, number of I/O device points: 8192, program capacity: 200K steps, basic operation processing speed (LD X0): 9.5 ns, program memory capacity: 800K bytes, multi-CPU high-speed communication, external interface: USB/RS-232, with memory card interface. Mitsubishi Electric has announced its discontinuation (2026/10 To be discontinued) — plan spares now; PartnerPLC also sources it on the surplus market after the end of order. Specifications and manuals below are Mitsubishi Electric's own data.

Specifications

Product

SeriesMELSEC-Q Series
CategoryProgrammable controller CPU
TypeUniversal model
Sales status2026/10 To be discontinued (Mitsubishi Electric)
OutlineNumber of I/O points: 4096, number of I/O device points: 8192, program capacity: 200K steps, basic operation processing speed (LD X0): 9.5 ns, program memory capacity: 800K bytes, multi-CPU high-speed communication, external interface: USB/RS-232, with memory card interface

Specifications

Control methodStored program cyclic operation
I/O control modeRefresh mode (The direct access input/output is available by specifying the direct access input/output (DX, DY).)
Programming language: Sequence control languageRelay symbol language, logic symbolic language, MELSAP3 (SFC), MELSAP-L, function block and structured text (ST)
Processing speed: Sequence instruction: LD X09.5 ns
Processing speed: Sequence instruction: MOV D0 D119 ns
Constant scan0.5...2000 ms (setting is available in increments of 0.5 ms by parameter)
Program capacity200K steps (800K bytes)
Memory capacity: Program memory (drive 0)800K bytes
Memory capacity: Memory card (RAM) (drive 1)Size of the installed memory card (8M bytes max.)
Memory capacity: Memory card (ROM) (drive 2)Size of the installed memory card (Flash card: 4M bytes max., ATA card: 32M bytes max.)
Memory capacity: Standard RAM (drive 3)1280K bytes
Memory capacity: Standard ROM (drive 4)4096K bytes
Memory capacity: CPU shared memory: QCPU standard memory8K bytes
Memory capacity: CPU shared memory: Multiple CPU high speed transmission area32K bytes
Maximum number of storable files: Program memory252
Maximum number of storable files: Memory card (RAM)319 (when the Q3MEM-8MBS is used)
Maximum number of storable files: Memory card (ROM): Flash card288
Maximum number of storable files: Memory card (ROM): ATA card511
Maximum number of storable files: Standard RAM4
Maximum number of storable files: Standard ROM256
Maximum number of intelligent function module parameters: Initial setting4096 parameters
Maximum number of intelligent function module parameters: Refresh2048 parameters
Number of I/O device points8192 points (X/Y0...1FFF)
Number of I/O points4096 points (X/Y0...FFF)
No. of device points: Internal relay (M)8192 points (M0...8191) by default (changeable)
No. of device points: Latch relay (L)8192 points (L0...8191) by default (changeable)
No. of device points: Link relay (B)8192 points (B0...1FFF) by default (changeable)
No. of device points: Timer (T)2048 points (T0...2047) by default (changeable) (Low-speed and high-speed timers available) Low-speed or high-speed is specified by an instruction. The measurement unit is set by parameter. (Low-speed timer: 1...1000 ms (in increments of 1 ms), default: 100 ms) (High-speed timer: 0.1...100.0 ms (in increments of 0.1 ms), default: 10.0 ms)
No. of device points: Retentive timer (ST)0 points by default (changeable) (Low-speed and high-speed retentive timers available) Low-speed or high-speed is specified by an instruction. The measurement unit is set by parameter. (Low-speed retentive timer: 1...1000 ms (in increments of 1 ms), default: 100 ms) (High-speed retentive timer: 0.1...100.0 ms (in increments of 0.1 ms), default: 10.0 ms)
No. of device points: Counter (C)Normal counter: 1024 points (C0...1023) by default (changeable)
No. of device points: Data register (D)12288 points (D0...12287) by default (changeable)
No. of device points: Extended data register (D)0 points by default (changeable)
No. of device points: Link register (W)8192 points (W0...1FFF) by default (changeable)
No. of device points: Extended link register (W)0 points by default (changeable)
No. of device points: Annunciator (F)2048 points (F0...2047) by default (changeable)
No. of device points: Edge relay (V)2048 points (V0...2047) by default (changeable)
No. of device points: File register (R): Standard RAM32768 points (R0...32767) (Maximum 655360 points are available by switching blocks.)
No. of device points: File register (R): SRAM card (1M byte)32768 points (R0...32767) (Maximum 517120 points are available by switching blocks.)
No. of device points: File register (R): SRAM card (2M bytes)32768 points (R0...32767) (Maximum 1041408 points are available by switching blocks.)
No. of device points: File register (R): SRAM card (4M bytes)32768 points (R0...32767) (Maximum 2087936 points are available by switching blocks.)
No. of device points: File register (R): SRAM card (8M bytes)32768 points (R0...32767) (Maximum 4184064 points are available by switching blocks.)
No. of device points: File register (R): Flash card (2M bytes)32768 points (R0...32767) (Maximum 1041408 points are available by switching blocks.)
No. of device points: File register (R): Flash card (4M bytes)32768 points (R0...32767) (Maximum 2087936 points are available by switching blocks.)
No. of device points: File register (ZR): Standard RAM655360 points (ZR0...655359) (Blocks do not need to be switched.)
No. of device points: File register (ZR): SRAM card (1M byte)517120 points (ZR0...517119) (Blocks do not need to be switched.)
No. of device points: File register (ZR): SRAM card (2M bytes)1041408 points (ZR0...1041407) (Blocks do not need to be switched.)
No. of device points: File register (ZR): SRAM card (4M bytes)2087936 points (ZR0...2087935) (Blocks do not need to be switched.)
No. of device points: File register (ZR): SRAM card (8M bytes)4184064 points (ZR0...4184063) (Blocks do not need to be switched.)
No. of device points: File register (ZR): Flash card (2M bytes)1041408 points (ZR0...1041407) (Blocks do not need to be switched.)
No. of device points: File register (ZR): Flash card (4M bytes)2087936 points (ZR0...2087935) (Blocks do not need to be switched.)
No. of device points: Link special relay (SB)2048 points (SB0...7FF) by default (changeable)
No. of device points: Link special register (SW)2048 points (SW0...7FF) by default (changeable)
No. of device points: Step relay (S)8192 points (S0...8191) by default (changeable)
No. of device points: Index register/standard device register (Z)20 points (Z0...19) (maximum)
No. of device points: Index register (Z) (32-bit index modification of ZR device)10 points (Z0...18) (maximum) (The index register is used as a double-word device.)
No. of device points: Pointer (P)4096 points (P0...4095) (The number of device points is fixed.) (The local pointer range and the common pointer range can be set by parameter.)
No. of device points: Interrupt pointer (I)256 points (I0...255) (The number of device points is fixed.) (The fixed scan interval for the system interrupt pointer I28 to 31 can be set by parameter.) 0.5...1000.0 ms (in increments of 0.5 ms) Default I28: 100 ms, I29: 40 ms, I30: 20 ms, I31: 10 ms
No. of device points: Special relay (SM)2048 points (SM0...2047) (The number of device points is fixed.)
No. of device points: Special register (SD)2048 points (SD0...2047) (The number of device points is fixed.)
No. of device points: Function input (FX)16 points (FX0...F) (The number of device points is fixed.)
No. of device points: Function output (FY)16 points (FY0...F) (The number of device points is fixed.)
No. of device points: Function register (FD)5 points (FD0...4) (The number of device points is fixed.)
Link direct deviceDevice that directly accesses the link device of a network module Specification format: J□□\X□□, J□□\Y□□, J□□\SB□□, J□□\W□□, J□□\SW□□
Intelligent function module deviceDevice that directly accesses the buffer memory of an intelligent function module Specified form: U...\G...
Latch (data retention during power failure) range8192 points (L0...8191) by default (The latch range can be set for the devices, B, F, V, T, ST, C, D, and W.)
RUN/PAUSE contactOne contact can be set up in X0 to X1FFF for each of RUN and PAUSE.
Clock functionYear, month, date, hour, minute, second, and day of week (automatic leap year detection) Accuracy: -2.96...+3.74 s (TYP. +1.42 s)/d at 0 ˚C Accuracy: -3.18...+3.74 s (TYP. +1.50 s)/d at 25 ˚C Accuracy: -13.20...+2.12 s (TYP. -3.54 s)/d at 55 ˚C
Allowable momentary power failure timeThe time differs depending on the power supply module used.
Internal current consumption (5 V DC)0.39 A
External dimensions: Height98 mm
External dimensions: Width27.4 mm
External dimensions: Depth89.3 mm
Weight0.20 kg

Specifications

Operating ambient temperature0...55 ˚C
Storage ambient temperature-25...75 ˚C (The storage ambient temperature is -20 to 75 ˚C if the system includes the AnS/A Series modules.)
Operating ambient humidity5...95 %RH, non-condensing (The operating ambient humidity and storage ambient humidity are 10 to 90 %RH if the system includes the AnS/A Series modules.)
Storage ambient humidity5...95 %RH, non-condensing (The operating ambient humidity and storage ambient humidity are 10 to 90 %RH if the system includes the AnS/A Series modules.)
Vibration resistance: Compliant with JIS B 3502 and IEC 61131-2: Under intermittent vibrationFrequency: 5...8.4 Hz, Half amplitude: 3.5 mm Frequency: 8.4...150 Hz, Constant acceleration: 9.8 m/s 2 Sweep count: 10 times each in X, Y, Z directions
Vibration resistance: Compliant with JIS B 3502 and IEC 61131-2: Under continuous vibrationFrequency: 5...8.4 Hz, Half amplitude: 1.75 mm Frequency: 8.4...150 Hz, Constant acceleration: 4.9 m/s 2
Shock resistanceCompliant with JIS B 3502 and IEC 61131-2 (147 m/s 2 , 3 times each in 3 directions X, Y, Z)
Operating atmosphereNo corrosive gases
Operating altitude0...2000 m
Installation locationInside a control panel
Overvoltage categoryII or less
Pollution degree2 or less
Equipment classClass I

Downloads & documentation

Official documents from Mitsubishi Electric (Factory Automation), downloaded directly from the manufacturer.

Data sheets & manuals

QCPU User's Manual (Hardware Design, Maintenance and Inspection) (SH-080483ENG-BC)PDF · 11.02MB
QnUCPU User's Manual (Function Explanation, Program Fundamentals) (SH-080807ENG-AF)PDF · 8.49MB
QCPU User's Manual (Multiple CPU System) (SH-080485ENG-V)PDF · 3.40MB
MELSEC-Q/L Programming Manual (Common Instruction) (SH-080809ENG-X)PDF · 24.23MB
MELSEC-Q/L Programming Manual (Structured Text) (SH-080366E-K)PDF · 2.14MB
MELSEC-Q/L/QnA Programming Manual (PID Control Instructions) (SH-080040-S)PDF · 7.54MB
MELSEC-Q/L/QnA Programming Manual (SFC) (SH-080041-X)PDF · 9.11MB
MELSEC-Q/L Programming Manual (MELSAP-L) (SH-080076-V)PDF · 8.80MB
MELSEC-Q/L/F Structured Programming Manual (Fundamentals) (SH-080782ENG-O)PDF · 1.59MB
MELSEC-Q/L Structured Programming Manual (Common Instructions) (SH-080783ENG-P)PDF · 10.34MB
12-month warrantyon all new stock
3-month warrantyon used & refurbished parts
30-day returnsno restocking fee on unused parts
Global shippingFast, tracked delivery worldwide

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