Home / Mitsubishi Electric (Factory Automation) / Mitsubishi MELSEC iQ-F Series – CPU Module / FX5U-32MT/ESS Mitsubishi MELSEC iQ-F Series CPU Module

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FX5U-32MT/ESS Mitsubishi MELSEC iQ-F Series CPU Module

MPN: FX5U-32MT/ESS · Brand: Mitsubishi Electric (Factory Automation)

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12-month warranty (new) · 3-month (used/refurbished)

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Quick facts

Availability	Confirmed on request
Category	Mitsubishi MELSEC iQ-F Series – CPU Module
Lifecycle	Active
Warranty	12-month (new) · 3-month (used/refurbished)

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When can FX5U-32MT/ESS be shipped?

FX5U-32MT/ESS is sourced on request — request a quote and we'll confirm the exact availability and shipping timeline for this specific unit.

Can I pick up FX5U-32MT/ESS in person?

Local pickup from our Groningen, Netherlands warehouse may be possible — contact us before ordering to check availability and arrange a collection time.

Is express delivery available?

Yes — mention it when you request a quote for FX5U-32MT/ESS and we'll include express shipping options in our reply.

My factory is down and I need this urgently — can you help?

For a critical breakdown, contact us directly at +31 (0)50-7110348 or sales@partnerplc.com — we can look into same-day courier or dedicated taxi/hotshot delivery for FX5U-32MT/ESS, subject to availability and destination.

The Mitsubishi Electric FX5U-32MT/ESS is a CPU Module in the MELSEC iQ-F Series. AC power supply DC input Screw terminal block type Input: 16 points 24 V DC sink/source Output: 16 points Transistor source Built-in analog input: 2 ch Built-in analog output: 1 ch Built-in high-speed counter: Up to 6 ch 200 kHz + 2 ch 10 kHz Built-in positioning: Up to 200 kHz 4 axis Built-in Ethernet port: 1 ch Built-in RS-485 port: 1 ch. Specifications and manuals below are Mitsubishi Electric's own data.

Specifications

Product

Series	MELSEC iQ-F Series
Category	CPU Module
Outline	AC power supply DC input Screw terminal block type Input: 16 points 24 V DC sink/source Output: 16 points Transistor source Built-in analog input: 2 ch Built-in analog output: 1 ch Built-in high-speed counter: Up to 6 ch 200 kHz + 2 ch 10 kHz Built-in positioning: Up to 200 kHz 4 axis Built-in Ethernet port: 1 ch Built-in RS-485 port: 1 ch

Specifications

Control system	Stored-program repetitive operation
Input/output control system	Refresh system (Direct access input/output allowed by specification of direct access input/output [DX, DY])
No. of input/output points: (1) No. of input/output points	256 points or less/384 points or less* *Supported with CPU module firmware version 1.100 and later. In addition, GX Works3 version 1.047Z and later is required.
No. of input/output points: (2) No. of remote I/O points	384 points or less/512 points or less* *Supported with CPU module firmware version 1.100 and later. In addition, GX Works3 version 1.047Z and later is required.
No. of input/output points: Total No. of points of (1) and (2)	512 points or less
Programming specifications: Programming language	Ladder diagram (LD), structured text (ST), function block diagram/ladder diagram (FBD/LD), sequential function chart (SFC)* *For supported versions, refer to MELSEC iQ-F FX5 User's Manual (Application).
Programming specifications: Programming extension function	Function block (FB), function (FUN), label programming (local/global)
Programming specifications: Constant scan	0.2 to 2000 ms (can be set in 0.1 ms increments)
Programming specifications: Fixed cycle interrupt	1 to 60000 ms (can be set in 1 ms increments)
Programming specifications: Timer performance specifications	100 ms, 10 ms, 1 ms
Programming specifications: No. of program executions	32
Programming specifications: No. of FB files	16 (Up to 15 for user)
Operation specifications: Execution type	Standby type, initial execution type, scan execution type, fixed scan execution type, event execution type
Operation specifications: Interrupt type	Internal timer interrupt, input interruption, high-speed comparison match interrupt, interrupt by modules* *Interrupt from the intelligent function module and high-speed pulse input/output module.
Command processing time: LD X0	34 ns* *When the program capacity is 64 k steps.
Command processing time: MOV D0 D1	34 ns* *When the program capacity is 64 k steps.
Memory capacity: Program capacity	64 k steps/128 k steps* (128 kbytes/256 kbytes, flash memory) *Supported with CPU module firmware version 1.100 or later. In addition, GX Works3 version 1.047Z or later is required.
Memory capacity: SD memory card	Memory card capacity (SD/SDHC memory card: Max. 16 Gbytes)
Memory capacity: Device/label memory	120 kbytes
Memory capacity: Data memory/standard ROM	5 Mbytes
Flash memory (Flash ROM) write count	Maximum 20000 times
File storage capacity: Device/label memory	1
File storage capacity: Data memory: P: No. of program files	32
File storage capacity: Data memory: FB: No. of FB files	16
File storage capacity: SD memory card: 2 Gbytes	511 The number of files stored in the root folder.
File storage capacity: SD memory card: 4 Gbytes, 8 Gbytes, 16 Gbytes	65534 The number of files stored in the root folder.
Clock function: Display data	Year, month, day, hour, minute, second, day of week (leap year automatic detection)
Clock function: Precision	Differences per month ±45 sec./25℃ (TYP)
Power failure retention (clock data): Retention method	Large-capacity capacitor Clock data is retained using the power accumulated in a large-capacity capacitor incorporated into the PLC. When voltage of the large-capacity capacitor drops, clock data is no longer accurately retained. The retention period of a fully charged capacitor (electricity is conducted across the PLC for at least 30 minutes) is 10 days (ambient temperature: 25℃). How long the ca
Power failure retention (clock data): Retention time	10 days (Ambient temperature: 25℃)
Power failure retention (device): Power failure retention capacity	Maximum 12 k word It is possible to back up all devices in device (high-speed) area. When a battery is used, it is also possible to back up devices in device (standard) area.

Number of device points

No. of user device points: Input relay (X): Octal	1024 points The total number of X and Y assigned to I/O points is up to 256 points/384 points* *Supported with CPU module firmware version 1.100 or later. In addition, GX Works3 version 1.047Z or later is required.
No. of user device points: Output relay (Y): Octal	1024 points The total number of X and Y assigned to I/O points is up to 256 points/384 points* *Supported with CPU module firmware version 1.100 or later. In addition, GX Works3 version 1.047Z or later is required.
No. of user device points: Internal relay (M): Decimal	32768 points (can be changed with parameter) Can be changed with parameters within the capacity range of the CPU built-in memory.
No. of user device points: Latch relay (L): Decimal	32768 points (can be changed with parameter) Can be changed with parameters within the capacity range of the CPU built-in memory.
No. of user device points: Link relay (B): Hexadecimal	32768 points (can be changed with parameter) Can be changed with parameters within the capacity range of the CPU built-in memory.
No. of user device points: Annunciator (F): Decimal	32768 points (can be changed with parameter) Can be changed with parameters within the capacity range of the CPU built-in memory.
No. of user device points: Link special relay (SB): Hexadecimal	32768 points (can be changed with parameter) Can be changed with parameters within the capacity range of the CPU built-in memory.
No. of user device points: Step relay (S): Decimal	4096 points (fixed)
No. of user device points: Timer system (Timer (T)): Decimal	1024 points (can be changed with parameter) Can be changed with parameters within the capacity range of the CPU built-in memory.
No. of user device points: Accumulation timer system (Accumulation timer (ST)): Decimal	1024 points (can be changed with parameter) Can be changed with parameters within the capacity range of the CPU built-in memory.
No. of user device points: Counter system (Counter (C)): Decimal	1024 points (can be changed with parameter) Can be changed with parameters within the capacity range of the CPU built-in memory.
No. of user device points: Counter system (Long counter (LC)): Decimal	1024 points (can be changed with parameter) Can be changed with parameters within the capacity range of the CPU built-in memory.
No. of user device points: Data register (D): Decimal	8000 points (can be changed with parameter) Can be changed with parameters within the capacity range of the CPU built-in memory.
No. of user device points: Link register (W): Hexadecimal	32768 points (can be changed with parameter) Can be changed with parameters within the capacity range of the CPU built-in memory.
No. of user device points: Link special register (SW): Hexadecimal	32768 points (can be changed with parameter) Can be changed with parameters within the capacity range of the CPU built-in memory.
No. of system device points: Special relay (SM): Decimal	10000 points (fixed)
No. of system device points: Special register (SD): Decimal	12000 points (fixed)
Module access device: Intelligent function module device: Decimal	65536 points (designated by U□\G□)
No. of index register points: Index register (Z): Decimal	24 points The sum of index register (Z) and long index register (LZ) is 24 words.
No. of index register points: Long index register (LZ): Decimal	12 points The sum of index register (Z) and long index register (LZ) is 24 words.
No. of file register points: File register (R): Decimal	32768 points (can be changed with parameter) Can be changed with parameters within the capacity range of the CPU built-in memory.
No. of file register points: Extended file register (ER): Decimal	32768 points (are stored in SD memory card)
No. of nesting points: Nesting (N): Decimal	15 points (fixed)
No. of pointer points: Pointer (P): Decimal	4096 points
No. of pointer points: Interrupt pointer (I): Decimal	178 points (fixed)
Others: Decimal constant (K): Signed	16 bits: -32768 to +32767 32 bits: -2147483648 to +2147483647
Others: Decimal constant (K): Unsigned	16 bits: 0 to 65535 32 bits: 0 to 4294967295
Others: Hexadecimal constant (H)	16 bits: 0 to FFFF 32 bits: 0 to FFFFFFFF
Others: Real constant (E): Single precision	E-3.40282347+38 to E-1.17549435-38, 0, E1.17549435-38 to E3.40282347+38
Others: Character string	Shift-JIS code max. 255 single-byte characters (256 including NULL)

Power supply specifications

Rated voltage	100 to 240 V AC
Voltage fluctuation range	-15%, +10%
Frequency rating	50/60 Hz
Allowable instantaneous power failure time	Operation can be continued upon occurrence of instantaneous power failure for 10 ms or less. When the supply voltage is 200 V AC or higher, the time can be change to 10 to 100 ms by editing the user program.
Power fuse	250 V, 3.15 A Time-lag fuse
Rush current	25 A max. 5 ms or less/100 V AC 50 A max. 5 ms or less/200 V AC
Power consumption	30 W This item shows value when all 24 V DC service power supplies are used in the maximum configuration connectable to the CPU module. (The current of the input circuit is included.)
24 V DC service power supply capacity	[When using 24 V DC service power supply for input circuit of CPU module] Ambient temperature 0 to 55℃: 400 mA Ambient temperature is lower than 0℃: 300 mA [When using external power supply for input circuit of CPU module] Ambient temperature 0 to 55℃: 480 mA Ambient temperature is lower than 0℃: 380 mA When I/O modules are connected, they consume current from the 24 V DC service power supply. For
5 V DC built-in power supply capacity	900 mA

Input specifications

No. of input points	16 points
Input connection type	Removable terminal block (M3 screws)
Input type	Sink/source
Input signal voltage	24 V DC +20%, -15%
Input signal current: X0 to X17	5.3 mA/24 V DC
Input impedance: X0 to X17	4.3 kΩ
ON input sensitivity current: X0 to X17	3.5 mA or more
OFF input sensitivity current	1.5 mA or less
Input response frequency: X0 to X5	200 kHz When capturing pulses of a response frequency of 50 to 200 kHz, refer to MELSEC iQ-F FX5S/FX5UJ/FX5U/FX5UC User's Manual (Hardware).
Input response frequency: X6 to X17	10 kHz
Pulse waveform: X0 to X5	T1 (pulse width): 2.5 μs or more T2 (rise/fall time): 1.25 μs or less
Pulse waveform: X6 to X17	T1 (pulse width): 50 μs or more T2 (rise/fall time): 25 μs or less
Input response time (H/W filter delay): X0 to X5	ON: 2.5 μs or less OFF: 2.5 μs or less
Input response time (H/W filter delay): X6 to X17	ON: 30 μs or less OFF: 50 μs or less
Input response time (Digital filter setting value)	None, 10 μs, 50 μs, 0.1 ms, 0.2 ms, 0.4 ms, 0.6 ms, 1 ms, 5 ms, 10 ms (initial values), 20 ms, 70 ms When using this product in an environment with much noise, set the digital filter.
Input signal format (Input sensor form)	No-voltage contact input Sink: NPN open collector transistor Source: PNP open collector transistor
Input circuit insulation	Photo-coupler insulation
Indication of input operation	LED is lit when input is on

Output specifications

No. of output points	16 points
Output connection type	Removable terminal block (M3 screws)
Output type	Transistor/source output
External power supply	5-30 V DC
Max. load	0.5 A/point The total load current per common terminal should be the following value. 4 output points/common terminal: 0.8 A or less
Open circuit leakage current	0.1 mA or less/30 V DC
Voltage drop when ON: Y0 to Y3	1.0 V or less
Voltage drop when ON: Y4 and subsequent	1.5 V or less
Response time: Y0 to Y3	2.5 μs or less/10 mA or more (5-24 V DC)
Response time: Y4 and subsequent	0.2 ms or less/200 mA or more (24 V DC)
Output circuit insulation	Photo-coupler insulation
Indication of output operation	LED is lit when output is on

Specifications

Firmware update function	This function updates the module's firmware using an SD memory card.
Scan monitoring function (Watchdog timer setting)	Detects an error in the hardware and program of the CPU module by monitoring the scan time.
Clock function	This function is used for the time management in the function which the system operates such as the date of the event history function, and data logging function.
Online change: Online ladder block change	Writes the part of a program edited on the ladder editor using the engineering tool to the CPU module in units of ladder blocks. Edited contents spanning multiple portions can be written to the CPU module at once.
Interrupt function: Multiple interrupt function	When an interrupt occurs while an interrupt program triggered by another cause is running, stops the program if its priority is lower than that of the new interrupt, and runs the higher-priority program whenever its execution condition is satisfied.
PID control function	Performs PID control by the PID control instruction.
Constant scan	Keeps the scan time constant and executes program repeatedly.
Remote operation: Remote RUN/STOP	Changes the CPU module status to the RUN/STOP/PAUSE status externally while the RUN/STOP/RESET switch of the CPU module is in RUN status.
Remote operation: Remote PAUSE	Changes the CPU module status to the RUN/STOP/PAUSE status externally while the RUN/STOP/RESET switch of the CPU module is in RUN status.
Remote operation: Remote RESET	Resets the CPU module externally while the CPU module is in the STOP status.
Device/label memory area setting	Sets the capacity of each area in the device/label memory.
Program capacity setting	Set to change program capacity.
Internal buffer capacity setting	Sets the capacity of the area (internal buffer) used by the system to temporarily store the results of data logging and memory dump processing.
Initial device value setting	Sets the initial values of devices used in the program directly (not via the program) to the devices.
Latch function	Holds the contents of the device and label of the CPU module when the power is turned ON etc.
Memory card function: SD memory card forced stop	Makes the SD memory card unavailable without turning OFF the power even when the function accessing the SD memory card is executed.
Memory card function: Boot operation	Transfers the file stored in the SD memory card to the transfer destination memory judged automatically by the CPU module when the power is turned ON or is reset.
Device/label access service processing setting	Sets the number of execution times of the device/label access service processing executed by END processing, with parameter.
Data logging function	Collects data at the specified interval or any desired timing, and stores them as a file on the SD memory card.
Memory dump function	Saves the data in the devices of the CPU module at a desired timing.
Real-time monitor function	Monitors the data in the specified device of the CPU module at a specified interval or at a desired timing in real time.
RAS function: Self-diagnostics function	Self-diagnoses the CPU module to see whether an error exist or not.
RAS function: Error clear	Batch-clears all the continuation errors being detected.
RAS function: Event history function	Collects operations executed and errors detected from the modules, and saves them in the CPU module, expansion board, expansion adapter, and intelligent module. The saved logs can be checked in chronological order.
Data backup/restoration function	Backs up program files, parameter files, and device/label data files in a CPU module to an SD memory card. The backup data can be restored as needed.
Security function	Protects resources stored in PCs and resources in the units in the system of the FX5 from illegal access by a third party such as theft, alteration, accidental operation and unauthorized execution.
IP filter function	Identifies the IP address of external devices over Ethernet, and blocks access from an invalid IP address.
High-speed input/output function: High-speed counter function	Performs high-speed counter, pulse width measurement, input interruption, etc. by using the input of the CPU module or high-speed pulse input/output module.
High-speed input/output function: Pulse width measurement function	Performs high-speed counter, pulse width measurement, input interruption, etc. by using the input of the CPU module or high-speed pulse input/output module.
High-speed input/output function: Input interrupt function	Performs high-speed counter, pulse width measurement, input interruption, etc. by using the input of the CPU module or high-speed pulse input/output module.
High-speed input/output function: Positioning function	Executes positioning operation by using the transistor output of the CPU module or high-speed pulse input/output module.
High-speed input/output function: PWM output function	Executes a PWM output by using the transistor output of the CPU module or high-speed pulse input/output module.
Built-in analog function: Analog input function	Two analog inputs are built in the FX5U CPU module so that voltage input can be performed.
Built-in analog function: Analog output function	One analog output are built in the FX5U CPU module so that voltage output can be performed.
Built-in Ethernet function	An Ethernet related function such as connection to MELSOFT products and GOTs, socket communication, file transfer using FTP, Web server (HTTP), SNTP client, and simple CPU communication function.
CC-Link IE Field Network Basic function	This function exchanges data between the manager station and remote station using general-purpose Ethernet.
Serial communication function	A function related to the serial communication such as N:N Network, parallel link, MC protocol, inverter communication function and non-protocol communication.
MODBUS communication function	Connection with the products which support MODBUS RTU/TCP is available. The master and slave functions can be used.

Specifications

Operating ambient temperature	-20 to 55℃, non-freezing The simultaneous ON ratio of available PLC inputs or outputs changes with respect to the ambient temperature, refer to MELSEC iQ-F FX5S/FX5UJ/FX5U/FX5UC User's Manual (Hardware). The operating ambient temperature is 0 to 55℃ for products manufactured before June 2016. For details on Intelligent function modules, refer to manuals of each product. In the case where operating
Storage ambient temperature	-25 to 75℃, non-freezing
Operating ambient humidity	5 to 95%RH, non-condensation When used in a low-temperature environment, use in an environment with no sudden temperature changes. If there are sudden temperature changes because of opening/closing of the control panel or other reasons, condensation may occur, which may cause a fire, fault, or malfunction. Furthermore, use an air conditioner in dehumidifier mode to prevent condensation.
Storage ambient humidity	5 to 95%RH, non-condensation
Vibration resistance: Installed on DIN rail: Frequency: 5 to 8.4 Hz	Half amplitude: 1.75 mm 10 times each in X, Y, Z directions (80 min in each direction) The criterion is shown in IEC61131-2. When the system has equipment which specification values are lower than above mentioned vibration resistance specification values, the vibration resistance specification of the whole system is corresponding to the lower specification.
Vibration resistance: Installed on DIN rail: Frequency: 8.4 to 150 Hz	Acceleration: 4.9 m/s 2 10 times each in X, Y, Z directions (80 min in each direction) The criterion is shown in IEC61131-2. When the system has equipment which specification values are lower than above mentioned vibration resistance specification values, the vibration resistance specification of the whole system is corresponding to the lower specification.
Vibration resistance: Direct installing: Frequency: 5 to 8.4 Hz	Half amplitude: 3.5 mm 10 times each in X, Y, Z directions (80 min in each direction) The criterion is shown in IEC61131-2. When the system has equipment which specification values are lower than above mentioned vibration resistance specification values, the vibration resistance specification of the whole system is corresponding to the lower specification.
Vibration resistance: Direct installing: Frequency: 8.4 to 150 Hz	Acceleration: 9.8 m/s 2 10 times each in X, Y, Z directions (80 min in each direction) The criterion is shown in IEC61131-2. When the system has equipment which specification values are lower than above mentioned vibration resistance specification values, the vibration resistance specification of the whole system is corresponding to the lower specification.
Shock resistance	147 m/s 2 , Action time: 11 ms, 3 times by half-sine pulse in each direction X, Y, and Z The criterion is shown in IEC61131-2.
Noise durability	By noise simulator at noise voltage of 1000 Vp-p, noise width of 1 μs and period of 30 to 100 Hz
Dielectric withstand voltage: Between power supply terminal (AC power supply) and ground terminal	1.5 kV AC for one minute
Dielectric withstand voltage: Between 24 V DC service power supply connected to input terminal (24 V DC) and ground terminal	500 V AC for one minute
Dielectric withstand voltage: Between output terminal (transistor) and ground terminal	500 V AC for one minute
Insulation resistance: Between power supply terminal (AC power supply) and ground terminal	10 MΩ or higher by 500 V DC insulation resistance tester
Insulation resistance: Between 24 V DC service power supply connected to input terminal (24 V DC) and ground terminal	10 MΩ or higher by 500 V DC insulation resistance tester
Insulation resistance: Between output terminal (transistor) and ground terminal	10 MΩ or higher by 500 V DC insulation resistance tester
Grounding	Class D grounding (grounding resistance: 100 Ω or less) (Common grounding with a heavy electrical system is not allowed) For grounding, refer to MELSEC iQ-F FX5S/FX5UJ/FX5U/FX5UC User's Manual (Hardware).
Working atmosphere	Free from corrosive or flammable gas and excessive conductive dust
Operating altitude	0 to 2000 m The PLC cannot be used at a pressure higher than the atmospheric pressure to avoid damage.
Installation location	Inside a control panel The programmable controller is assumed to be installed in an environment equivalent to indoor.
Overvoltage category	II or less This indicates the section of the power supply to which the equipment is assumed to be connected between the public electrical power distribution network and the machinery within premises. Category II applies to equipment for which electrical power is supplied from fixed facilities. The surge voltage withstand level for up to the rated voltage of 300 V is 2500 V.
Pollution degree	2 or less This index indicates the degree to which conductive material is generated in the environment in which the equipment is used. Pollution level 2 is when only non-conductive pollution occurs. Temporary conductivity caused by condensation must be expected occasionally.

Downloads & documentation

Official documents from Mitsubishi Electric (Factory Automation), downloaded directly from the manufacturer.

Data sheets & manuals

MELSEC iQ-F FX5U CPU Module Hardware Manual (JY997D53401)	PDF · 0.57MB
MELSEC iQ-F FX5 Programming Manual (Program Design) (JY997D55701-M)	PDF · 2.22MB
MELSEC iQ-F FX5 Programming Manual (Instructions, Standard Functions/Function Blocks) (JY997D55801-AB)	PDF · 12.39MB
MELSEC iQ-F FX5S/FX5UJ/FX5U/FX5UC User's Manual (Hardware) (SH-082452ENG-Q)	PDF · 7.58MB
MELSEC iQ-F FX5 CPU Module Function Block Reference (JY997D62701-L)	PDF · 1.44MB
MELSEC iQ-F FX5 User's Manual (Communication) (SH-082625ENG-J)	PDF · 15.18MB
MELSEC iQ-F FX5 User's Manual (Application) (JY997D55401-AG)	PDF · 13.14MB
MELSEC iQ-F FX5 Ethernet, EtherNet/IP, CC-Link IE Function Block Reference (JY997D64901-S)	PDF · 3.51MB
MELSEC iQ-F Cam Output Control Function Block Reference (SH-082060ENG-C)	PDF · 1.84MB
MELSEC iQ-F Statistical Analysis Function Block Reference (Basic) (SH-082093ENG-E)	PDF · 1.40MB